ITT unveils sealed, miniature, lightweight connectors for “future soldier” applications

DW : Can you please elaborate on some current solutions designed/developed by ITT which are at the forefront of defense technology?

Keith Teichmann: At this point, it’s all about smaller and lighter devices with increased functionality and more signal throughput in a smaller package. ITT Interconnect Solutions is meeting each of these demands with innovative, advanced connector designs, pioneered over nearly 95 years in the interconnect markets. ITT’s Trinity MKJ Series connectors, for example, meet MIL-DTL-38999 specifications and are up to 71% lighter and 52% smaller than comparable devices, with size 23 pin and socket contacts that have the equivalent electrical performance of size 22 contacts, while reducing contact spacing to 0.193mm. Also meeting all MIL-DTL-38999 specifications and a companion product to Trinity MKJ, ITT’s Nemesis WT Series connectors weigh just 25 grams and are being deployed in a variety of modern and “future soldier” applications, such as sophisticated command, control, communications, computer, and intelligence (C41) systems. At the same time, ITT’s NDD Series micro-nano connectors feature 0.635mm pitch contact spacing, allowing for high signal density in minimal space while conforming to all MIL-DTL-32139 specifications. With size and weight significantly reduced, soldiers become more mobile and equipment becomes more portable.

DW : What products/innovations can we expect from ITT going forward. Can you highlight some R & D projects which hold great promise for the future?

Keith Teichmann: Similar to question 1, miniaturization and increased functionality, including new mating capabilities, are forefront in our product innovations due to market demands. We are also slowly evaluating and integrating magnetic coupling technologies and placing greater emphasis on materials technology including composite materials. Potentially integrating various connector form factors, such as rectangular products, into a broad composite offering holds great promise for future innovations.

DW : What products are you displaying at DSEI and how are they different from competing products? What are the key technology differentiators?

Keith Teichmann: We introduced two new products at DSEI. The first is our Nemesis sealed, miniature, lightweight connectors for modern and “future soldier” applications. These connectors are overmolded, sealed, and fully integrated with our proven pogo pin and industry leading breakaway technologies. While competing products incorporate some of these features, Nemesis is the only one of its kind that includes all of the mentioned benefits in a single package. We also introduced our PowerLock sequential connecting box for portable power generation and power cabling in military field operations. Unlike comparable devices, ITT’s PowerLock Box features color coding to meet European, North American and Australian three-phase standards; keyed ports to prevent incorrect connections; 400 and 660A continuous current options; IP2X finger protection, and a variety of other features.

DW : As a leading supplier of defense electronics can you please describe ITT's product development philosophy and strategy?

Keith Teichmann: ITT’s strategy is heavily based upon VOC (voice of customer). VOC provides us with important insight into potential trends that may not be readily apparent, or new innovations that are being pursued by customers in defined markets. Meeting VOC requirements isn’t simply implementing the customer’s stated parameters; but rather, taking those parameters further and dissecting factors that may be hidden or perhaps unknown to the customer. Developing solutions that respond to a customer’s needs from a different perspective, and are innovative as compared to the other solutions available on the market, ensures not only added value for the customer but increased growth in the connector industry. After VOC, we look at the manufacturing processes that will change how ITT will bring products to market, as well as any new technologies that will supplant our current products.

DW : What markets do your products address besides the U.S. and its allies. How do you look at Asia and the Middle East, which is experiencing maximum growth in defense procurement?

Keith Teichmann: Three major areas of growth for us particularly in Asia and the Middle East are with defense vehicles, UAV’s, and satellites. MRAP’s are replacing Humvees in the Middle East and becoming extremely popular. We have a number of circular connectors on all of these vehicles. With regards to UAV’s, once again they are growing in use in Asia and the Middle East, and we have a number of D-subminiature, micro, and filter connectors employed in UAV technology. Finally, ITT is one of the biggest players in the global satellite market, and our micro-nano and D-subminiature connectors are used extensively in these applications.